Hubbell HYC2C4 Grounding and Bonding, C-Tap, DB, #2AWG, 4, Index C, 10-Pack
HYC2C4|40-HYC2C4
Hubbell HYC2C4 Grounding and Bonding, C-Tap, DB, #2AWG, 4, Index C, 10-Pack
HYC2C4|40-HYC2C4
Hubbell Premise Wiring
Hubbell HYC2C4 Grounding and Bonding, C-Tap, DB, #2AWG, 4, Index C, 10-Pack
HYC2C4 | 40-HYC2C4
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Aperçu
Spécifications
Documents
Aperçu
The Hubbell HYC2C4 Grounding and Bonding C-Tap is a reliable compression device designed for bonding and grounding purposes. Featuring die index verification, it ensures the correct die is used for each crimp, enhancing accuracy and safety. These compression taps create a permanent and low-resistance connection between conductors, ensuring optimal performance. Sold in packs of 10, this product is an essential component for anyone needing secure and efficient electrical connections. Upgrade your setup with Hubbell's trusted quality today.
Principales caractéristiques
Renseignements généraux
Nom:Hubbell HYC2C4 Grounding and Bonding, C-Tap, DB, #2AWG, 4, Index C, 10-Pack
Category:Hubbell Premise Wiring, Batteries & Power Supplies, Power Accessories & Parts
UPC Code:
Country of Origin:. Country of origin is subject to change.
Spécifications
ADI Numéro du produit 40-HYC2C4 Code fabricant HYC2C4 Fabricant Hubbell Marque Hubbell Premise Wiring Nom de produit Grounding and Bonding, C-Tap, DB, #2MPAWG,4MP, Index C,10MPPack Série de produit Grounding and Bonding Type de produit Compression C-Tap
Latence CAS (Column Address Strobe) Copper
Hauteur 0.98"